This invention comprises a novel architecture for thin or thick-film circuitry on a flexible or soft or stretch-able substrate composed of metallic elastic-plastic highly ductile materials, which enables the circuitry to sustain significant strains without breaking, and yet adhere to the substrate while it is stretched, bent, twisted or otherwise deformed.
Flexible electronics are critical to a host of internet-ready devices including wearable sensing, biometric and communication devices, implants, roll-to-roll manufactured panels, etc. Flexible electronics are at the heart of the emerging revolution in the 'Internet of Things'' concept. A key requirement to realize the promise of the IOT is flexible electronics to enable the manufacture of reliable stretch-able metallic electrical circuitry on flexible polymer substrates, which may be subjected to significant strains during service. However, most metallic materials, especially in thin film form, are not very ductile, and crack or peel off from substrates at relatively small applied strains, particularly when the substrate is more ductile than the film.
The current, innovation from researchers at WSU addresses these issues via a cost effective method that results in maintaining a solid connection and allow for dense interconnected structures to be produced.
Applications and Advantages
• Novel method that allows for vast improvement over what is currently available
• Allows for alternative architectures in densely packed circuitry
• Cost effective alternative to conventional metals (gold) that allows for more ductile mixtures with significant stretch-ability