Method to create three dimensional sub-mm wavelength, and sub-THz frequency antennas on flexible and in-situ cured dielectric material along with directly printed metallic antenna elements over the dielectric. The three dimensional sub-mm wavelength antennas have applications in wearable flexible electronics as well as ultra-high speed chip-to-chip communication. Reliable antenna designs with three dimensional curved geometries can provide significant area/volume compaction and directionality to the signal propagation.
Applications and Advantages:
Wearable flexible electronics as well as ultra-high speed chip-to-chip communications.
Intellectual Property Protection:
Issued Patent, US 10,086,432