Office of Commercialization Search Results - deuk+heo

Search Results - deuk+heo

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Power Supply Modulators with Voltage and Frequency Partitioning
Abstract:Efficiency improvements of power amplifiers in wireless communication devices. Envelope tracking is a popular technique to improve efficiency of power amplifiers in current 4G LTE communication systems. However, next-generation wireless communications will feature ultra-high bandwidth, such as 250 MHz, to support the increasing demand for...
Published: 6/3/2019   |   Inventor(s): Deuk Heo, Zhiyuan Zhou, Nghia Tang
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Small-World Network-on-Chip (SWNoC) Routing Methods and Systems
Abstract:Millimeter(mm)-wave wireless Small-World NoC (SWNoC) is an enabling interconnect architecture to design high performance and low power multicore chips. SWNoC has an overall irregular topology, making it important to design suitable deadlock-free routing mechanisms. This technology incorporates irregular network routing strategies. Tested against...
Published: 4/26/2019   |   Inventor(s): Partha Pande, Deuk Heo
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Low Power Local Oscillator Distribution and Phase Shifting Circuits
Abstract:Wireless communication devices often require incoming high frequency radio signals to be shifted and converted from analog prior to digital processing. This demands high power use, and circuits are sensitive to effects of parasitic capacitance. This patented technology offers improved performance and includes a sub-harmonic injection-locked...
Published: 9/28/2018   |   Inventor(s): Deuk Heo, Suman Sah
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3D Printed Flexible Antennas
Abstract:Method to create three dimensional sub-mm wavelength, and sub-THz frequency antennas on flexible and in-situ cured dielectric material along with directly printed metallic antenna elements over the dielectric. The three dimensional sub-mm wavelength antennas have applications in wearable flexible electronics as well as ultra-high speed chip-to-chip...
Published: 2/21/2018   |   Inventor(s): Rahul Panat, Deuk Heo
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Printed Three-Dimensional (3D) Passive Integrated Circuit (IC) Components
Challenge: Traditional IC manufacturing methods require separately manufactured components, limiting efficiency in manufacture and size.Technology Abstract: Printed 3D IC passive component architectures, nano-powder inks and composite material used to make them, and the associated direct-write manufacturing methods with jetting of nano-powder inks....
Published: 12/7/2016   |   Inventor(s): Rahul Panat, Deuk Heo
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